Product construction:
| Surface Coating: low static finishing |
| Backing: Polyimide |
| Adhesive: Silicone |
Technical Data:
| Product |
Units |
Test values |
Test method |
| Backing Thickness: |
mm |
0,25 |
|
| Total Tape Thickness: |
mm |
0,06
±0,005 |
|
| Adhesion to Steel: |
N/25cm |
5~6 |
GB-T2972-98 |
| Tensile Strength at Break: |
N/25cm |
>80 |
GB-T7753-87 |
| Elongation at Break: |
% |
>45 |
GB-T7753-87 |
| Upmost use Temperature: |
°C |
280 |
|
| Surface resistance: |
ohms |
105~8 |
|
Static Charge:
|
Removal from roll: |
V |
<100 |
|
| Removal from board: |
V |
<50 |
|
| Dielectric Strength |
V |
8000 |
GB/T7752-87 |
Remark: When testing the surface static voltage, the tape peeling speed is 300mm/min
Features:
Low-Static Polyimide Film Tape employs a proprietary technology that results in low electrostatic discharge at unwinding from roll
and removal from the board. Conventional polyimide tape typically generate over 10,000volts during use, which can damage the electronic components . The low static properties of Low Static Polyimide Film Tape can eliminate circuit board degradation.
Storage Details:
Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging.
Shelf life is 6 months from the date of manufacture.
Remark:
All technical data is based upon lab tests or experience. However, many
factors depend on the user’s knowledge and control. Therefore, it is essential that the user evaluate
the product to determine whether it is fit for a particular purpose and suitable for the user’s method
of application.
