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Anti-Static Polyimide Film Tape

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Anti-Static Polyimide Film Tape
Product construction:
Surface Coating: anti static finishing
Backing: Polyimide
Adhesive: Silicone

Technical Data:
Product Units  Test values Test method
Backing Thickness: mm 0,25  
Total Tape Thickness: mm 0,055
±0,005
 
Adhesion to Steel: N/25cm 5.5 GB-T2972-98
Tensile Strength at Break: N/25cm  >80 GB-T7753-87
Elongation at Break:  %  >45 GB-T7753-87
Upmost use Temperature:  °C  280  
Surface resistance:  ohms  105~8  
 Static Charge:
 
Removal from roll:  V  <30  
Removal from board:  V  <30  
 Dielectric Strength  V  4000  GB/T7752-87
Remark: When testing the surface static voltage, the tape peeling speed is 300mm/min

Features:
Anti-Static Polyimide Film Tape employs a proprietary technology that results in extremely low electrostatic discharge at unwinding from roll
and removal from the board. Conventional polyimide tape typically generate over 10,000 volts during use,  which can damage the electronic components . The low static properties of Anti-Static Polyimide Film Tape can eliminate circuit board degradation.

Storage Details:
Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging.
Shelf life is 6 months from the date of manufacture.

Remark:
All technical data is based upon lab tests or experience. However, many
factors depend on the user’s knowledge and control. Therefore,  it is essential that the user evaluate
the product to determine whether it is fit for a particular purpose and suitable for the user’s method
of application.